Goods imported for the manufacture of excisable goods - concessional rate of duty.

28-2-1999

Notification No. 25/99-Customs

        In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby exempts the goods specified in column (3) of Table below, and falling under the Chapters of the First Schedule to the Customs Tariff Act, 1975 (51 of 1975) specified in the corresponding entry in column (2) of the said Table, when imported into India for use in the manufacture of the finished goods specified in the corresponding entry in column (4) of the said Table, from so much of that portion of the duty of customs leviable thereon which is specified in the said First Schedule, as is in excess of the amount calculated at the rate of, -

            (a) 5% ad valorem in the case of the imported goods specified in List A;

            (b) 15% ad valorem in the case of the imported goods specified in List B; and

            (c) 25% ad valorem in the case of the imported goods specified in List C:

        Provided that the importer follows the procedure set out in the Customs (Import of Goods at Concessional Rate of Duty for Manufacture of Excisable Goods) Rules, 1996.

Table

S.No.

Chapter

Description of imported goods

Description of finished goods

(1)

(2)

(3)

(4)

1.

LIST A
15,29,32, 34,39,48, 70

Alpha cellulose paper/cotton paper; Electrical grade kraft paper; Tung oil; Volan/Silane treated glass fabric/cloth

Copper clad laminates phenolic or paper phenolic or glass ep-oxy types; composite type copper clad laminates; printed circuit boards.

2.

25,28,40, 56,70,84, 85

Potassium carbonate/Pottasium Nitrate(prilled); Barium carbonate; Pumice powder; Cerium oxide; Anode buttons; Necks and Neck tubings; Wool felt; Spodumene

Glass shell/parts of television picture tube.

3.

25,28,40, 70, 84, 85

Strontium carbonate; garnet powder; stud pins; Titanium dioxide; sodium antimonate; rubber sleeve

Class shells/parts for colour picture tubes.

4.

Omitted

5.

28

High purity gases : Argon; halocarbon-14; halocarbon-116; halocar-bon-23; helium; silicon tetra-chloride; sulphur hexafluoride; chlorine; silane; hydrochloric acid; phosphine & silane mixture; boron trichloride; dichlorosilane; diborane; hydrogen bromide; phosphine in nitrogen; nitrous oxide; boron trifluoride; arsine & arsine mixture; phosphine in hydrogen; hydrogen; nitrogen

Integrated circuits, Semi- conductor devices.

6.

28,29

High purity chemicals: 
Acetic acid MOS/CMOS grade; Sulphuric acid MOS/ CMOS grade; Hydrochloric acid MOS/CMOS grade; Buffered oxide etchant MOS/ CMOS grade; Ammonium fluoride MOS/CMOS grade; Trichloro-ethylene MOS/ CMOS grade; Isopropyi alcohol MOS/CMOS grade; Acetone MOS/CMOS grade; Hydrofluoric acid MOS/ CMOS grade; Nitric acid MOS/CMOS grade; Phos-phoric acid MOS/CMOS grade; Hydrogen peroxide MOS/ CMOS grade

Integrated circuits, Semi-conductor devices.

7.

28,29,38, 76

Cadmium sulphide; cadmium telluride; silicon dioxide; cadmium chloride; zinc telluride; indium; germane; disilane; phosphine; hydrogen fluoride; aluminium sputtering target; zinc oxide sputtering target, adhesive coated aluminium foil; high purity hydrogen high purity nitrogen; high purity argon; copper doped graphite paste; high purity methane; diborane in high purity helium

Solar cells/modules.

8.

28,29,32 38,39,68 74

., Copper plating salts, their i, brighteners, levellers, condi tioners, replenishers, stabi lizers; Black Oxide Coating (Microtech) solution/ salts, predip solution/salts, palladium catalyst solution/ salts

Printed Circuit Boards.

9.

28,29,32 38,71

Resistive, Conductive, Di-electric, Overglaze or solder pastes, compositions or inks in packing not exceeding 20 kg.

Hybrid Microcircuits; Potentiometers; Resistors (other than heating resistors); Ceramic and Mica Capacitors; Conductive Rubber Switches/Key Boards.

10.

28,29,32, 
39,48,69, 
74,85

Ceramic bodies (coated or uncoated); bandoliering tape with or without adhesives; solder plated copper wire of dia. upto 1 mm; solder plated brass wire of dia. upto 1 mm; high melting point solder alloy; paper backed polyurethane tape; epoxy marking ink with or without hardner/thinner

Thermistors.

11.

28,29,34

Resist stripper

Semi-conductor devices, printed circuit boards.

12.

28,29,34, 
85

Special materials:

Surfactant, tetra ethyl-ortho-silicate (TEOS); trimethyl borate (TMB); trimethyl phosphite (TMPI); trichloroethane (TCA); dichloroethylene; sputtering targets; photo resist primer; edge bead remover

Integrated circuits, Semi-conductor devices.

13.

28,29,37

Photo resist & associated thinners or/and developers; photospin glass

Semi-conductor devices, printed circuit boards.

14.

28,29,38

Electrolyte

Etched or Formed Aluminium Foil, Electrolytic Capacitors.

15.

28, 29,38

Dopants or doping sources in all forms, and with or without precious metal constituents

Semi-conductor devices.

16.

28,29,38, 
39

Epoxy/Epoxide resins/ Epoxy moulding powder, compounds or encapsulants; Fillers, thinners, hardeners, accelerators and fire retardants

Capacitors; Semi-conductor Devices; Light Emitting Diodes; Moulded Piezoelectric Crystals; Liquid Crystal Displays; Electronic Valves and Tubes; Switches; Copper clad laminates of glass epoxy/paper expoxy type; composite type copper clad laminates; Delay lines; Line and Wave Traps; Potentiometers; Silicon Crystals or Silicon wafers; Connectors; Resistors (other than heating resistors); Deflection parts; Loudspeakers; Magnetic Heads; Paper Cones/ Spiders/Dust Caps for Loudspeaker; Hybrid Microcircuits; Printed parts.

17.

28, 32

Ferric Oxide of purity of 99% and above; Manganous Manganic Oxide of purity of 99% and above; Manganese di-oxide of purity of 99% and above, Manganous Oxide; Nickel Oxide; Strontium Carbonate

Ferrites.

18.

28,38,39, 
70, 74,76

Aluminium paste; ethylene vinyl acetate sheets (EVA); primer for EVA; Crane glass; tedlar coated aluminium sheet; phosphorous oxychloride; halo carbon (CF4)/Freon gas; tinned copper interconnect; toughened glass with low iron content and transmittivity of min. 90% and above; multilayered sheets with tedlar base; fluro polymer resin; ultra high purity (UHP) silane in UHP nitrogen; UHP silane; diborane in UHP silane; MOCVD grade phosphine in UHP silane; silver sputtering target; high purity tin tetrachloride; nitrogen trifluoride of 99% purity and above

Solar cells/modules.

19.

28,39, 68, 
73

Blue steel lapping carriers/lapping carriers; lapping vehicles; lapping abrasive powder; lapping compound

Mounted piezoelectric crystals; Printed Circuit Boards; Semi-conductor devices; Potentiometers; Resistors (other than heating resistors); Connectors; Switches; Relays; Tape deck mechanism; Magnetic heads; Deflection parts; DC micromotor upto 13.5 V not exceeding 20 Watt rating; Silicon in all forms, LED lamps and displays..

20.

28,29, 81, 
85

Tantalum powder; Tantalum wire; CM Seals; Cans; Silver powder suspension; Manganese Nitrate; Heat shrinkable polyester tubing

Tantalum capacitors.

21.

28,48,69, 75,78,81, 
84

Lead based ceramic composition; Magnesium titanate based ceramic composition; Neodium based ceramic composition; Alumina setters/slabs; Lint free paper/paper towels/filter paper; Zirconia milling media/high alumina tumbling media; Steel shots - copper plated hollow; Nickel and sulphonic acid based plating chemicals; Razer blades/doctor blades

Ceramic dielectric (multilayer) capacitors.

22.

28, 68

Tantalum Neodyme oxide; Neodyme oxide; Strontium carbonate

Ceramic Capacitors.

23.

28,70,73, 
75, 85

Crystal Holders; Bases; covers; Glass Bulbs; Glass Bases; Nickel Eyelets; Springs; Solder wire 25 SWG or thinner; Chromium Pellets

Mounted Piezoelectric crystals.

24.

28, 81

Tungsten rhenium wire; Suspension of aluminium oxide in binder; Suspension of tungsten powder and aluminium oxide in binder; Triple carbonate suspension of calcium, barium, strontium in binder

Electron guns and electron gun parts.

25.

29

Tetra Bromo Bisphenol-A; Tricresyl/Aryl Phosphate

Copper clad laminates for Printed Circuit Boards.

26.

32

Electron Phosphor

Electronic Valves and Tubes

27.

32

Desmearing agents

Printed Circuit Boards.

28

32,35,39

Silicone based resins, oils, varnishes, lacquers, elastomers, with or without additives

Semi-conductor Devices; Liquid Crystal Displays; Electronic Valves and Tubes; Resistors (other than heating resistors); Connectors; Magnetic Tape; Relays; Potentiometers; Switches; Capacitor grade metallised plastic film; Piezoelectric crystal; Hybrid Micro circuits.

29.

32,37, 39

Solder Mask/Resist in ink or film form, with or without associated catalysts

Printed Circuit Boards.

30.

32,38

Screen printing inks, dyes, emulsions, lacquers, films (including sensitisers, hardners, catalysts)

Semi-conductor devices, printed circuit boards, potentiometers, capacitors, hybrid microcircuits, printed parts, coils and inductors, resistors (other than heating resistors).

31.

32, 38

Internal Dag

Electronic Valves and Tubes.

32.

35, 39

Polyamide coatings or adhesives

Semi-conductor devices; Heat sinks; deflectioii parts.

33

37

Photo Polymer Film

Printed Circuit Boards; Liquid Crystal Displays.

34

37, 39

High resolution, high contrast photographic films and photo stencil films; DIAZO (C6H5N2) films

Printed Circuit Boards; semi-conductor devices; hybrid microcircuits.

35.

37, 70

High Resolution Photo Plates; Photomask Substrates

High Resolution Photo Masks; Semi-conductor devices; Liquid Crystal Displays; Silicon Single Crystals or Wafers.

36.

37, 70

High resolution photo mask

Semi-conductor devices; Printed Circuit Boards; Liquid Crystal Displays.

37.

38

Silicon in the form of undiffused wafers, discs or chips

Semi-conductor devices.

38.

38,39,76

Polyvinyl flouride (TEDLAR); Tedlar Aluminium Tedlar

Solar cells/modules.

39.

38, 81

Lithium niobate wafers

Hybrid microcircuits.

40.

38, 85

Silicon in the form of diffused wafers, discs or chips (with or without molybdenum disc)

Hybrid microcircuits or semi-conductor devices.

41.

38, 85

Getters

Electronic valves and tubes.

42.

39

Glass epoxy or/and polyamide prepregs

Multilayer Printed Circuit Boards; copper clad laminates.

43.

39

Silicone rubber

Keypad switches; parts of EHT transformers.

44.

39

Plastic Film Capacitors or Mixed Dielectric Capacitors, other than Power Capacitors.

Plastic Film Capacitors; Mixed Dielectric Capacitors.

45.

39

Nylon 6.30% glass filled, flame retardant moulding powder/granules and with or without other additives

Potentiometers; connectors.

46.

39

Plain and glass filled nylon/polyamide with or without other additives

Relays; Potentiometers; tape deck mechanism; connectors.

47.

39

Polypropylene moulding powder / granules

Deflection parts; Cassettes.

48.

39

Polybutylene terephthalate

Connectors; deflection parts; switches; relays.

49.

39

Heat shrinkable PVC sleeving, tubing, film or ring

Capacitors; relays; deflection parts.

50.

39

Polyurethane lapping pads

Mounted piezoelectric crystals; Printed Circuit Boards/semi-conductors devices; potentiometers; resistors (other than heating resistors); connectors; switches; relays; tape deck mechanisms; magnetic heads; deflection parts; DC Micromotors upto 13.5 volts and not exceeding 20 watts rating silicon (in all forms).

51.

39

Plain polystyrene film

 Plain film capacitors; mixed dielectric capacitors.

52.

39

Plain plastic film (other than Polystyrene film) of thickness 12 microns or below

'Explanation.- For the removal of doubt, "plan plastic film" includes Biaxially Oriented Polypropylene (BOPP) film; 

Electronic capacitor grade metallised dielectric plastic film.

53.

39

Release film for multilayer laminates

Printed Circuit Boards.

54.

39, 40

Polyvinyl Alcohol, Polyisobutylene, Chlorosulphona ted Polyethylene (HYPALON)

Ferrites.

55.

39, 43

Antistatic materials in the form of tubes, strips, mats, covers, bins, boxes, containers

Semi-conductor devices. Hybrid microcircuits.

56.

39,48,59, 85

Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesive

Capacitors; deflection parts; resistors (other than heating resistors); semi-conductor devices; inductors.

57.

39,48,85

Domes or Dust caps; Paper/Plastic cones

Loudspeakers.

58.

39,48,85

Parts of Potentiometers

Potentiometers.

59.

39, 59, 73

Screen mesh of stainless steel/polyester/metallised polyester/metallised nylon (in sizes of mesh 60 or above)

Ceramic capacitors.

60.

39, 69, 
73,85

Ceramic/alumina substrates

Potentiometers; printed parts.

61.

39, 73, 79,85

Parts of magnetic sound heads

Magnetic sound heads.

62.

39,74

Copper clad laminates laminated to nylon, teflon, polyester; Aluminium clad entry foil and back up laminates

Printed Circuit Boards.

63.

39,85

Polyethylene terephthalate film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 50 to 180 microinch

Floppy diskettes.

63A.

 39,73

Moulded shell with liner, Steel hub ring, spring, shutter

Floppy diskette (3.5" size).

64.

39,85

Parts/articles of silicone, Elastomer or Silicone rubber

Liquid Crystal Displays; Semi-conductor Devices; EHT Transformers; Potentiometers; Electrolytic Capacitors; Solid tantalum capacitors.

65.

39,85

Formers, bases, bobbins; Holders, brackets; Shielding cases,cans

RF/IF coils or transformers or deflection parts.

66.

40,59

Bungs; Rubber pinch rollers with or without plastic bush

Electrolytic capacitors; tape deck mechanisms.

67

40, 84,85

Parts of Rotor Assembly; Commutator assembly or parts thereof; Brush assembly or parts thereof

DC Micromotors upto 13.5 volts and not exceeding 20 watts rating.

68.

40, 85

Anode assembly consisting of EHT cable, silicone rubber cap and contact spring or parts thereof (EHT cable in cut pieces or running length)

Deflection parts.

69.

48

Electrolytic Capacitor/Condenser Tissue paper

Electrolytic Capacitors; Plastic Film Capacitors.

70.

48,76

Kraft paper/tissue paper or aluminium foil for voice coil

Loud-speakers (cone type).

71

59

Felt sheet (fully compressed) of 1.5 mm thickness and below

Tape deck mechanism.

72.

69, 78,85

Headers; Caps with or without leads; Cans with or without leads; Pins; Stud seals; Lead beads; Ceramic beads; Ceramic-glass packages; Cap to Lead Assembles; Ceramic Pipes; Lead frames, single or in roll form; Housings; Brass ring

Semi-conductor devices; Light Emitting Diodes; Resistors (other than heating resistors); Capacitors; Connectors; Hybrid Microcircuits; Printed parts.

73.

69, 85

Alumina rods and bars (with Alumina content above 90%) in coated or uncoated form; Ceramic plates/flats/cases/ bases/formers; Steatite rods and bars in coated or uncoated form

Resistors (other than heating resistors); Semi-conductor Devices; Hybrid Microcircuits; Electron Guns and Electron Gun parts.

74.

69,85

Ceramic dielectric (coated or uncoated)

Ceramic capacitors.

75.

70

Glass filament yam

Silane treated glass cloth/fabric for use in the copper clad laminates.

76.

32,70,85

Glass frit or glass powder; Glass preforms or pellets; Glass tubes

Liquid Crystal Displays; semi-conductor devices; Electronic valves and tubes (other than television picture tubes/cathode ray tubes); Glass to metal seals; Lead frames; Transistor headers; Reed relays or Reed switches; delay lines; resistors (other than heating resistors); mounted piezoelectric crystals; electron guns and electron gun parts; gas discharge tubes.

77.

70, 85

Fused Quartzware

Semi-conductor devices; silicon in all forms.

78.

71

Synthetic quartz crystal blocks and blanks

Mounted Piezoelectric crystals.

79.

71

Contact tape with pure Nickel base and Crown Gold alloy; Contact tape with solder Diamond Back in fine silver; Contact tape in silver or silver alloy with or without palladium with Gold overlay

Relays; Switches.

80.

71

Gold in the form of wire, ribbon, preform of purity 99.99 % and above

Semi-conductor devices; Light Editing Diodes.

81.

71, 72, 75,80

Nickel plated steel strip; tin silver antimony alloy

Semi-conductor devices.

82.

71, 76, 85

Aluminium wire with silicon or magnesium impurity of upto 2%; gold wire with phosphorous or antimony doping

Semi-conductor devices.

83.

72

CRNGO silicon steel strip /sheet/coil/hoop with or without tin plating

DC Micromotor; Potentiometer; Resistors.

84.

72

Coated/uncoated electro-galvanised CRCA/ mild steel/ stainless steel in the form of sheet / strip /wire/coils

DC Micromotor; tape deck mechanism.

85.

72,73

Iron of 99.7% purity and above

Cast Alloy Permanent Magnets.

86.

72, 73, 75,81

Nickel Iron Cobalt Alloy in all forms

Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals/lead frames; cast alloy permanent magnets; hybrid microcircuits; gas discharge tubes.

87.

72 or 73

Copper clad tin coated steel wire, dia 0.4 mm to 1.2 mm/ solder plated Copper cover steel wire (SPC).

Lead tabs for electrolytic capacitors.

88.

73,85

Metal clad substrates in any form with or without tags

Potentiometers; Hybrid microcircuits; Printed parts; semi-conductor devices; Light Emitting Diodes.

89.

74

Electrolytic Tough Pitch (ETP) Copper wire rods

Lead wire for electronic parts.

90

74

Solder plated/unplated brass-strips upto 100 mm width; silver plated brass strips upto 100 mm width

Potentiometers/parts of potentiometers; connectors/parts of connectors; switches/parts of switches; relays/parts of relays

91.

74

Phosphor Bronze Sheets/ bars/ section/ flats/ strips/wire/rods/foils/ pipes, with or without plating

Relays/parts of relays; Tape Deck Mechanism; connectors/parts of connectors; potentiometers/parts of potentiometers; Heat Sinks; cassettes; parts of cassettes; T.V.Tuner; telescopic antenna; gas discharge tubes/parts of gas discharge tubes.

92.

74

Beryllium Copper rods/ strips/sheets/wire/foils with or without plating; Rectangular Profile Brass material(CuZn39Pb2)

" Connectors/parts of connectors; relays/parts of relays; switches/parts of switches; gas discharge tubes/parts of gas discharge tubes.

93.

74

Tin coated/solder plated copper wire

Resistors.

94.

74

Continuous cast copper wire rod/copper scrap, electrolytic grade of purity 99.9% or above

Copper foil for copper clad laminates.

95.

74,76, 85

Copper-cadmium braided wire/Self-soldering/self-bonding aluminium wire

Loudspeakers; microphones.

96.

74,85

Oxygen-free high conductivity (OFHC) Copper base with weldable steel ring

Semi-conductor devices.

97.

74,85

OFHC copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes

Semi-conductor devices; electronic valves and tubes; transistor headers; glass to metal seals; capacitors.

98.

74,85

Rayon or Silk cover Litz wire of the following sizes -(a) 6, 8, 12 and 24 strands with each strand diameter 0.03 mm; (b) 6 or 9 strands with each strand diameter 0.04 mm

RF/IF Coils or transformers.

99.

74,85

Parts made of OFHC copper

Semi-conductor devices, electronic valves & tubes, transistor headers, glass to metal seals, capacitors.

100.

76

Etched or formed Aluminium Foils

Electrolytic Capacitors.

101.

76

Plain Aluminium foil containing more than 99% Aluminium

Etched or formed Aluminium foil; electrolytic capacitors or plastic film capacitors.

102.

76

Aluminium of purity 99% or above in the form of wire, strips, sheets, rods, bars, pipes, plates, sections, ribbons or shapes

Cans or Leads for Electrolytic Capacitors; Semi-conductor Devices; Light Emitting diodes; Capacitors; Capacitor grade Metallised Plastic films; Potentiometers; Disc covers for electrolytic capacitors.

103.

81

Cobalt

Cast Alloy Permanent Magne ts.

104.

81

High purity chromium powder (99.99% and above)

Semi-conductor devices, Mounted piezo electric crystals, electronic valves and tubes, vacuum interrupter tubes.

105.

81,85

Molybdenum and molybdenum alloys, wrought, in all forms and articles and parts thereof

Electronic Valves and Tubes; X-ray tubes; Semi-conductor Devices; Mounted Piezoelectric Crystals.

106.

84,85

Parts of Vacuum Interrupter Tubes

Vacuum Interrupter Tubes.

107.

85

Self bonding/Self soldering insulated or enamelled copper wire

Deflection parts; Loudspeakers; Relays; Magnetic Heads; RF/IF Coils ; Transformers(other than Power transformers) and DC Micromotors upto 13.5 volts and not exceeding 20 watts rating; electronic tuner.

108.

85

Parts of gas discharge tubes

Gas discharge tubes.

109.

85

Light Emitting Diodes in the form of Chips, wafers or undiced discs

Light Emitting. Diodes; Lamps and Displays.

110.

85

Parts of Cathode Ray Tubes (other, than Glass parts)

Cathode Ray Tubes.

111.

85

Lead Tabs/Paddle Tabs

Electrolytic Capacitors.

112.

85

Parts of Relays, Switches, Connectors

Relays; Switches; Connectors.

113.

85

Parts of electron Guns

Electron Guns, Television picture tubes or Cathode Ray Tubes.

114.

85

Casings of aluminium

Electrolytic capacitors.

115.

85

Parts of CD-Deck Mechanism

CD Deck Mechanism.

116.

85

Parts of Fly-back Transformer

Flyback Transformers.

117.

85

Parts of Tuners

TV Tuners.

118.

85

Parts of Data Cartridge

Data Cartridge.

119.

85

Parts of transmitting tubes

Transmitting tubes.

120.

85

Parts of deflection yoke (DY), excluding colour deflection yoke core

Deflection parts.

121.

75,85, 90

Nickel and nickel alloys, wrought in all forms and articles thereof

Semi-conductor Devices; Liquid Crystal Displays; Electronic valves and tubes; Pick-up cartridges; Stylii; X-Ray Tubes; Cast Alloy Permanent magnets; Transistor Headers; Glass to metal seals; Lead frames; Resistors (other than heating resistors); Magnetic Heads; Potentiometers; Electron guns and electron gun parts; Electro-magnetic shields; Encoders and synchros.

122

39,74,75,76

Composite copper clad materials consisting of Paper + Epoxy + Glass cloth

Printed Circuit Boards

123

74

Glass Epoxy Copper clad laminates or Paper Phenolic Copper clad laminates

Printed Circuit Boards

124

74

Copper foils(plain or adhesive coated)

Copper clad laminates (phenolic or glass epoxy types);composite type copper clad laminates; multi-layer Printed Circuit Boards

125

28,29,38,72,74,84

Cupric Chloride Etchant; Ammonical Etchants; Solid Carbide Drills; Routers; Hot Air Levelling Flux; Electroless Copper Plating Solution; Sensitisers; Activators; Post Activators; Copper foil of refined copper; Colloidal / Semi colloidal Graphite (Shadow)

Printed Circuit Boards

126

28,29,39,68,71,81,82

Plastic Film for Wafer Dicing; Graphite Jigs / Block/ Rods / Plates; Dicing blades / wheels; Tungsten filament and or parts thereof; Tungsten Wire / Rod; Colour Paste and Diffusants; Silver conductive paste / Suspension; Palladium Wire; n- Butyl Acetate; Bonding Tools

LED/LED Displays; Semiconductor Devices; Hybrid Microcircuits; Mounted Piezo Electric Crystals; Resistors; Potentiometers

127

70,85

Parts of data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm

Data graphic display tubes(colour), with a phosphor dot screen pitch smaller than 0.4mm

128

70,75

Glass Tubes/ Insulators/ Spacers; Nickel Eyelets

Mounted piezo electric crystals

129

39

Diallylphthalate (DAP) Moulding Powder or Compound (Plain or Glass/Fiber filled with or without additives)

Connectors; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Potentiometers; Relays of contact rating upto 7 amperes; Resistors

130

39

Polyvinyl Chloride Film/Sheet

Floppy Disks/Diskettes

131

28,38,39

Gold plating make up and replenisher solutions and salts; Resins for gold recovery

Semiconductor devices; LED/LED Displays; Connectors; PCBs

132

74

Solder Plated Annealed Copper Wire (SCA) of diameter 0.4mm to 1mm

Plastic film capacitors

133

79

Zinc of purity 99% or above in Rod, Wire or Strip form; Zinc Wire / Zinc- Aluminum wire with dia up to 5mm ; Tin - zinc wire with dia upto 3mm

Electronic Capacitor Grade Metallised Plastic Film / Capacitors

134

80

Tin Foil/ Tin Alloy Foil

Plastic Film Capacitors; Resistors (other than heating resistors)

135

76

Aluminium wire (of purity 99.9% or above ) of dia upto 3mm

Lead Wires/Lead Tabs for electrolytic capacitors; Electronic Capacitor grade Metallized Plastic film; Plastic film capacitors; semiconductor devices

136

28

Barium Carbonate

Ceramic Capacitors

137

38,39,69

Hydroxy Propyl Methyl Cellulose Barium Titanate based or Lead Titanate based Ceramic composition / Powder

Ceramic Capacitors, Ceramic Substrates /Rods/ Discs / Dielectric

138

28

Magnesium Oxide (Purity not less than 98%); Zinc Oxide (Purity not less than 98%); Nickel Oxide (Purity not less than 98%); Aluminium Oxide (Purity not less than 99.9%); Vanadium Pentoxide (Purity not less than 99.9%); Lithium Carbonate (Purity not less than 99%); Manganese Carbonate (Purity not less than 98%); Bismuth Oxide (Purity not less than 99%); Cobalt Oxide (Purity not less than 99%); Copper Carbonate (Purity not less than 98%); Chromium Oxide (Purity not less than 98%); Indium Oxide (Purity not less than 99%); Dysprosium oxide (Purity not less than 99%); Gadolinium Oxide (Purity not less than 99%);Yttrium Oxide (Purity not less than 99.9%); Calcium Carbonate (Purity not less than 98%) ; Tin Oxide (Purity not less than 98%); Magnesium Carbonate (Purity not less than 99%); Iron Oxide (Purity not less than 99%); Barium Carbonate (Purity not less than 99%)

Resistors; Ceramic Capacitors

139

39,48,59

Resin -VAGH Co-Polymerised Vinyl Chloride Vinyl Acetate,
Pressure Sensitive felt, with or without adhesive,Silicon Coated/ Carbonized silicon paper

 

140

39

Polyimide Film (Kapton)

 

141

39

Modified Polyphenylene Oxide

 

142

39

Phenolic Moulding Powder/ Resin

 

143

72,74

Lead wires of Iron or non alloy steel plated or coated with other base metals

 Lead Tabs

144

29,72,74,76, 85

Copper alloy resistance wire and strips; Steel or Aluminium in substrate or sheet form; Butyl DiGol

 

145

81

Metal alloy targets

Resistors; Resistor Grade Metallized Ceramic Cores

146

85

Chip Transistors; Varicap Diodes

Tuners; Modulators; Hybrid Micro Circuits

147

74

Cladded Copper/ Copper Alloy Strip / Foil

Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors

148

28

Zinc Oxide (Purity minimum 99.5%);Strontium Oxide/ Strontium Carbonate; Zinc Stearate (Purity minimum 99%); Polyvinyl alcohol (PVA); Polyvinyl Butyral (Ash Content max 1%)

Pre-Calcined Ferrite Powder (Spray Dried); Resistors

149

28

Zirconium Oxide (Purity not less than 99%); Tin Oxide (Purity not less than 99%); Lanthanam Oxide (Purity not less than 99%); Zinc Oxide (Purity not less than 98%); Polystyrene (Purity not less than 98%); Magnesium Oxide (Purity not less than 98%); Calcium Carbonate (Purity not less than 98%); Tantalum Oxide (Purity not less than 99%); Barium Carbonate (Purity not less than 99%)

Microwave Dielectrics; Ceramic Capacitors; Resistors ; Varistors; Thermistors

150

39

Phenolic Moulding Powder / Resin

Hybrid Micro circuits; Potentiometers; Ceramic Capacitors; Thermistors; Varistors ; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC; Connectors

151

39,69

Guide Ceramic; Guide LCP (Liquid Crystal Polymer)

Print heads

152

85

Parts of Loudspeaker

Loudspeakers

153

74,85

High Voltage Rectifier Diodes; Focus Potmeter; Electrolytic Tough Pitch Wire/Rods/Formed Pins/parts made thereof

Deflection Components

154

39

Polycarbonate (Plain or glass filled moulding powder)

Resistors; Potentiometers; Switches with contact rating less than 5 amperes at voltage not exceeding 250 Volts AC or DC

155

39

Poly Vinyl Acetate

Resistors; Potentiometers; Hybrid Micro Circuits

156

72

Nickel Iron (low carbon / gas free grade) in Sheet or strip form / EB Welded Triple Metal Strips./ Controlled Expansion Alloy Strips

Resistors; Potentiometers ;

157

39

SRBP (Synthetic Resin Bonded Paper) Substrates

Potentiometers; Switches with contact rating les than 5 amperes at voltage not exceeding 250 Volts AC or DC

158

25

Ball Clay

Ceramic Cores / Substrates for resistors

159

32

Borosilicate Glass Powder

Parts of Electron Gun / Multiform Bead Glass Rods

160

74

Unplated Brass Strips in Coil form 70 mm width; Phosphor Bronze Strips in Coil Form

Connectors

161

72,74

Bimetal sheets in coil forms / piece parts; Copper clad steel sheets in coil forms / piece parts

Relays of contact rating upto 7 amperes

162

28,29

Ammonium Dihydrogen Phosphate ; Ammonium pantaborate

Electrolytic Capacitors

163

38

Carbon / Flurographite Powder

Potentiometers

164

28,34

Boron Nitride Suspension ; Metallisation Inhabitation Fluid (Oil)

Electronic Capacitor Grade metallised Plastic Film/ Plastic Film Capacitors

165

29

Dowanol PX-16S (Non- CFC solvent)

Flyback Transformers / Focus Resistors

166

28,29,38,48

Monoalkylethers of ethylene glycol.; Flux 1544 ;Ammonium Hydroxide (CMOS Grade); Ammonia (NH3) (CMOS Grade); Lid perform; Chemcassette

Semiconductor devices

167

76

Etched Aluminium Foil

Formed Aluminium Foil for electrolytic capacitors.

168

28, 39

Dyes; Optical grade polycarbonate; Jewel box

CD-R (unrecorded CD)

LIST B

1.

28

Litharge

Glass shells/parts for colour picture tubes.

2.

28

Gamma Ferric Oxide

Magnetic Inks or Magnetic Tape.

3.

38

Precalcined / Pre-sintered ferrite powder

Ferrites

4.

58,69,84, 85

Molybdenum Silidde/ Molybdenum disilicide heating elements; conveying trays; saggers

Ferrites

5.

 

Omitted vide Notification No.26/2002 dt.01.03.2002

 

6.

 

Omitted vide Notification No.26/2002 dt.01.03.2002

 

7.

 

Omitted vide Notification No.26/2002 dt.01.03.2002

 

LIST C

1.

 

Omitted

 

2.

 

Omitted

 

3.

 

Omitted

 

4.

 

Omitted

 

5.

70

TV Glass bulbs/shells; CRT Glass Bulbs/shells; Magnetron Glass bulbs/shells

Television picture tubes. Cathode Ray tubes or magnetrons.

6.

70

Glass parts for colour picture tubes (excluding neck or reneck tubes)

Colour picture tubes.

7.

70

Parts of TV/CRT Glass bulbs/shells including panels, funnels. Glass tubes (excluding neck or reneck tubes)

TV Glass bulbs/shells for TV picture tube or CRT Glass bulbs/shells for CRT.

8

70

Neck or reneck tubes

CRT Glass bulbs/shells for CRT.

9.

 

Omitted

 

10.

 

Omitted

 

Notification No. 25/99-Cus., dated 28-2-1999 as amended by Notification No. 60/99-Cus., dated 11-5-1999 , No. 20/2000-Cus., dated 1-3-2000  No. 54/2000-cus., dated 4-5-2000. No. 20/2001-Cus, dated 01-03-2001, Notification No.26/2002 dt.01.03.2002 and Notification No 57/2002-cus dated 31-5-2002 and Notification No. 108/2002-Cus., dated 10-10-2002.